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1. A Fast and Flexible Software for IC Reverse Engineering CPCI-S 会议论文 认领

作者:Kim, G;Ma, M;Park, I

作者全称:Kim, Gyungtae;Ma, Ming;Park, Inhag

作者机构:[Kim, Gyungtae] Natl Nanofab Ctr, Daejeon, South Korea.;[Ma, Ming] Inner Mongolia Univ, Coll Comp Sci, Hohhot, South Korea.;[Park, Inhag] Syst Centroi 更多

通讯作者地址:Kim, G (reprint author), Natl Nanofab Ctr, Daejeon, South Korea.

会议名称:17th Annual International Conference on Electronics, Information, and Communication (ICEIC)

会议日期:JAN 24-27, 2018

来源:2018 INTERNATIONAL CONFERENCE ON ELECTRONICS, INFORMATION, AND COMMUNICATION (ICEIC),2018

基金:Material Technology Development Program through the National Research Foundation of Korea (NRF) - Ministry of Science, ICT and Future Planning [2015M3A7B7045527]

关键词:Reverse Engineering; Circuit Extraction; IC Extraction Software

摘要:This paper presents a fast and flexible CAD tool for Reverse Engineering (RE) in the semiconductor industry. It has applied various techniques such as 更多

更新时间:Mar 28, 2019
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