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1. A fast and flexible software for IC reverse engineering SCOPUS EI 期刊论文 会议论文 认领

作者:Kim G.;Ma M.;Park I.

作者全称:Kim, Gyungtae;Ma, Ming;Park, Inhag

作者机构:[Kim, Gyungtae] National Nanofab Center, Daejeon, Korea, Republic of.;[Ma, Ming] College of Computer Science, Inner Mongolia University, Hohhot, Chin 更多

来源:International Conference on Electronics, Information and Communication, ICEIC 2018,2018,Vol.2018-January

基金:Number; Acronym; Sponsor 2015M3A7B7045527; NRF; National Research Foundation

摘要:This paper presents a fast and flexible CAD tool for Reverse Engineering (RE) in the semiconductor industry. It has applied various techniques such as 更多

更新时间:Mar 28, 2019
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