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1. Heat Spreading Aware Floorplan for Chip Multicore Processor CPCI-S 会议论文 认领

作者:He, LQ;Narisu, C

作者全称:He, Liqiang;Narisu, Cha

作者机构:[He, Liqiang; Narisu, Cha] Inner Mongolia Univ, Coll Comp Sci, Hohhot, Peoples R China.

第一作者:He, Liqiang

通讯作者:He, LQ

通讯作者地址:He, LQ (reprint author), Inner Mongolia Univ, Coll Comp Sci, Hohhot, Peoples R China.

会议名称:International Conference on Computer Engineering and Applications

会议日期:JUN 06-08, 2009

来源:PROCEEDINGS OF 2009 INTERNATIONAL CONFERENCE ON COMPUTER ENGINEERING AND/ APPLICATIONS,2009

关键词:Chip Multicore Processor; thermal; floorplan

摘要:With more cores integrated into one chip and multiple threads running concurrently on the chip, power consumption from the running threads increases d 更多

更新时间:Mar 28, 2019
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