标题:A Fast and Flexible Software for IC Reverse Engineering
作者简称:Kim, G[1];Ma, M[2];Park, I[3]
通讯作者地址:Kim, G (reprint author), Natl Nanofab Ctr, Daejeon, South Korea.
会议名称:17th Annual International Conference on Electronics, Information, and Communication (ICEIC)
会议日期:JAN 24-27, 2018
会议地点:Honolulu, HI
会议发起人:IEEE, Inst Elect & Informat Engineers, Consumer Elect Soc
年份:2018
语种:English
基金:Material Technology Development Program through the National Research Foundation of Korea (NRF) - Ministry of Science, ICT and Future Planning [2015M3A7B7045527]
文献类型:Proceedings Paper
WOS号:WOS:000450093300015
ISSN号:2377-8431
WOS类别:Engineering, Electrical & Electronic; Telecommunications
研究方向:Engineering; Telecommunications
关键词:Reverse Engineering; Circuit Extraction; IC Extraction Software
摘要:This paper presents a fast and flexible CAD tool for Reverse Engineering (RE) in the semiconductor industry. It has applied various techniques such as 更多
核心收录:CPCI-S
资源类型:外文期刊论文
版权说明
文件名称:
文件大小: 0
内容类型:
版本类型: 出版稿
开放类型: 开放获取
使用许可: CC BY-NC-SA
相关成果:
TOP